Parameter (1)
|
CW Output Power |
Po |
W |
65 |
- |
- |
| Threshold Current |
Ith |
A |
- |
1.2 |
- |
| Operating Current |
Iop |
A |
- |
9 |
10 |
| Operating Voltage |
Vop |
V |
- |
17 |
19 |
| Slope Efficiency |
η |
W/A |
- |
7 |
- |
| Electrical-to-Optical Efficiency |
PE |
% |
- |
43 |
- |
| Center wavelength |
λc |
nm |
877.6 |
- |
879.6 |
| Spectral width (FWHM) |
δλ |
nm |
- |
0.5 |
-- |
| Back reflection wavelength Range |
λ |
nm |
1040 |
- |
1200 |
| Back reflection isolation |
- |
dB |
- |
30 |
- |
| Wavelength Shift with Temperature |
- |
nm/℃ |
- |
0.03 |
- |
| Fiber Data |
Cladding Diameter |
Dclad |
μm |
- |
220 |
- |
| Core Diameter |
Dcore |
μm |
- |
200 |
- |
| Numeric Aperture |
NA |
- |
- |
0.22 |
- |
| Fiber Length |
Lf |
m |
- |
2 |
- |
| Connector |
- |
- |
- |
SMA905 |
- |
| Minimum Bending Radius |
- |
mm |
66 |
- |
- |
| Others |
ESD |
Vesd |
V |
- |
- |
500 |
| Storage Temperature |
Tstg |
℃ |
-20 |
- |
70 |
| Lead Soldering Temp |
Tls |
℃ |
- |
- |
260 |
| Lead Soldering Time |
t |
sec |
- |
- |
10 |
| Operating Case temperature |
Top |
℃ |
20 |
- |
35 |
| Relative Humidity |
RH |
% |
15 |
- |
75 |
| Operating Notes |
● Avoid eye exposure to direct or scattered radiation.
● ESD precautions must be taken.
● Please connect pins to wires by solder instead of using socket when operation current is higher than 6A.
● Soldering point should be close to the root of the pins. Soldering temperature should be lower than 260 and time shorter than 10 second.
● Use constant current power supply. Avoid surge current.
● Laser diode must be used according to the specifications.
● Laser diode must work with good cooling.
● Operation temperature is 20℃~ 30℃.
● Storage: 20℃~ +70℃, all pins short circuit. |
| Remark |
(1) Data measured under operation output at 65W@25℃.
(2) Operating temperature defined by the package case. Acceptable operating range is 20℃ - 30℃, but performance may vary.
(3) Wavelength stabilized to >90% power in band of 877.1nm to 880.1nm |
 |
